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Deep insights into the increasingly complex task of designing, testing, integrating, and manufacturing semiconductors. Explore the latest in Semiengineering and cutting-edge chip technology.
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News
Redefining Processes At Sub-2nm
4+ day, 7+ hour ago (591+ words) Discrete steps are being merged with others as dimensions shrink into the angstrom range. The lines between discrete semiconductor manufacturing processes are starting to blur at sub-2nm nodes as transistors continue to shrink, sensitivity to various processes rises, and the…...
Chip Industry Technical Paper Roundup: Sept. 8
6+ day, 7+ hour ago (109+ words) HBF for LLM inference; M3D SRAM with BEOL pass-gates at 2nm; distributed GPU architectures; hybrid HBM-HBF memory; GaN-on-silicon polarization superjunctions; programmable silicon photonics; Al dopant activation in 4H-SiC. The post Chip Industry Technical Paper Roundup: Sept. 8 appeared first on Semiconductor Engineering. Chip…...
Chip Industry Week In Review
1+ week, 3+ day ago (328+ words) In-Depth Reports and Deals New Technologies Security Vehicles Research Quantum Workforce | Education Events and Webinars EPFL researchers demonstrated a GaN-on-Si transistor using a polarization superjunction that sustained more than 3.4 kV, along with diodes that exceeded 3.9 kV. Seoul National University-led researchers…...
Humanoid Compute, Security More Complex Than AVs
1+ week, 4+ day ago (553+ words) Robots and autonomous vehicles are both edge devices, but a humanoid has wheels as well as fingers. Close interaction with humans raises the stakes. The market for robots and humanoids is growing rapidly for industrial applications, but it’s poised for…...
Security Sign-Off Is Coming For Chips — But Standards May Not Be Enough
1+ week, 5+ day ago (541+ words) SE: Does the industry have a good understanding of the impact of AI on PQC? SE: How soon? Shouldn’t it have already happened? Petr: Assuming there are people in that stack who can do that. Giles: I completely agree. It…...
EBook - Accelerate Silicon Design for Physical AI (Part 1)
1+ week, 5+ day ago (96+ words) A complete path from AI model, to trusted silicon, to deployable system. Physical AI demands more than traditional edge silicon. Devices must perceive, reason, and act in real time while protecting data and scaling across product lines. This eBook shows…...
Chip Industry Technical Paper Roundup: Sep. 1
1+ week, 6+ day ago (98+ words) Semiconductor Engineering Chip Industry Technical Paper Roundup: Sep. 1 Wafer-scale optical interconnects for LLM training; Rowhammer-based inference attacks; 3D-IC test cases; liquid cooling for 2.5D/3D packages; wafer-scale 2D semi growth; DL-based parameter extraction for 2D transistors; and chip-placement optimization. New technical papers recently added…...
Advancing The CFET-Based Device Roadmap: Novel Integration Modules And Standard Cell Configurations
1+ week, 6+ day ago (815+ words) Part I – Pioneering work in developing CFET-critical modules: an improved backside contact module and a novel gate stack for threshold voltage tuning. By Cassie Sheng, Hiroaki Arimura, and Naoto Horiguchi The semiconductor industry is going through a major architectural transition,…...
M3D 6T SRAM With BEOL Pass-Gates at 2nm (Georgia Tech, Synopsys)
2+ week, 1+ day ago (207+ words) Researchers from Georgia Institute of Technology and Synopsys published a technical paper titled “A Process-Aware Hybrid Si/IGO Monolithic-3D 6T SRAM with BEOL Pass-Gates for the 2nm Node.” Abstract Excerpt: The paper proposes “a monolithic-3D (M3D) 6T SRAM at the 2nm node” that integrates BEOL…...
How Cadence and TSMC Are Accelerating AI Silicon Design at Advanced Nodes
2+ week, 4+ day ago (159+ words) Advanced-node design to reduce iterations and improve correlation for DTCO-focused advanced AI and HPC designs. How Cadence and TSMC Are Accelerating AI Silicon Design at Advanced Nodes Advanced-node design to reduce iterations and improve correlation for DTCO-focused advanced AI and…...