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News
Can GPUs Continue To Dominate AI Compute?
5+ day, 7+ hour ago (1623+ words) Google, Amazon, and now OpenAI have competitive offerings and are gaining share. GPUs are 70% of installed worldwide AI compute capacity by manufacturer (see figure 1), with custom silicon accounting for 30%, primarily Google and Amazon. Fig. 1: Current installed worldwide AI compute capacity…...
Extending 18A With Significant Power And Performance Gains
1+ week, 5+ day ago (239+ words) Compared to Intel 18A, the new architecture lowers external resistance by approximately 20% for NMOS devices and 12% for PMOS devices, enabling higher drive current and higher operating frequencies at matched capacitance.² As a result, Power Boost helps designers extract more performance from…...
Cycle-Level Simulator for Distributed GPUs For AI Workloads (Purdue)
2+ week, 1+ day ago (180+ words) Researchers from Purdue University published a technical paper titled “Architecting the Next Generation of Asynchronous, Distributed GPUs for the AI Era.” Abstract Excerpt: The paper presents a “cycle-level simulation framework” for modern GPU generations including Ampere, Hopper, and Blackwell. It…...
Rowhammer Backdoor Injection Attack During Inference (Northeastern)
2+ week, 2+ day ago (64+ words) Researchers from Northeastern University published a technical paper titled “ROBBIN: Rowhammer-Based Backdoor Injection during Inference.” Abstract excerpt: “This work presents ROBBIN, a hardware-aware Rowhammer-based backdoor injection attack that integrates the device-specific vulnerability into the backdoor construction process. ROBBIN first characterizes…...
Generative Design Optimizes Liquid-Cooling Channels For 2.5D And 3D Packages (UM-Dearborn)
2+ week, 2+ day ago (186+ words) Researchers from University of Michigan-Dearborn published a technical paper titled “Generative Design of Liquid-Cooling Channels for Thermal Management of 2.5D and 3D Integrated Advanced Packaging.” Abstract Excerpt: The paper presents “a physics-guided generative design framework for liquid cooling channel topology optimization” in…...
How Cadence and TSMC Are Accelerating AI Silicon Design at Advanced Nodes
2+ week, 4+ day ago (159+ words) Advanced-node design to reduce iterations and improve correlation for DTCO-focused advanced AI and HPC designs. How Cadence and TSMC Are Accelerating AI Silicon Design at Advanced Nodes Advanced-node design to reduce iterations and improve correlation for DTCO-focused advanced AI and…...
The Future Of AI Compute Won’t Run On Just One Kind Of Chip
3+ week, 5+ day ago (257+ words) Power, token cost, interconnects, and software orchestration are pushing data centers toward heterogeneous clusters built from CPUs, GPUs, NPUs, optics, and custom accelerators. SE: Compute clusters comprised of multiple processors acting as a single computer present many design challenges around…...