2+ day, 6+ hour ago   (282+ words) Researchers at the NIST, UCSD et al. published a technical paper titled “Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging.” Abstract Excerpt: “Epoxy underfill materials are critical to advanced semiconductor packaging by enhancing…...

3+ day, 19+ hour ago   (181+ words) Enabling a comprehensive digital verification thread built on Verification Capture Points, structured coverage artifacts that link parameterized requirements to the verification results, models, context, and configurations. The post Rethinking Verification Traceability for Modern Systems appeared first on Semiconductor Engineering. As…...

3+ day, 19+ hour ago   (591+ words) Discrete steps are being merged with others as dimensions shrink into the angstrom range. The lines between discrete semiconductor manufacturing processes are starting to blur at sub-2nm nodes as transistors continue to shrink, sensitivity to various processes rises, and the…...

3+ day, 19+ hour ago   (202+ words) How early RTL testability analysis and DFT optimization enable shift left strategies that improve manufacturing test quality, reduce turnaround time, and deliver early quality estimates. The post Accelerating Shift Left With Early RTL DFT Analysis And Connectivity Verification appeared first…...

3+ day, 19+ hour ago   (1695+ words) Kilowatt-class AI accelerators are forcing engineers to rethink what counts as adequate coverage across workload, thermal behavior, test hardware, and time. On a spec sheet, 1kW of maximum power looks like a single operating condition. In practice, two workloads can hold…...

3+ day, 19+ hour ago   (172+ words) By Huayuan Li, Alex Hong, Johnny Mu, and Timothy Kryman Building a bipolar-CMOS-DMOS (BCD) device is one challenge; maintaining the material consistency required for reliable high-volume manufacturing (HVM) is another. In fact, achieving consistent device performance starts long before the…...

3+ day, 19+ hour ago   (473+ words) By Guy Cortez, Dan Alexandrescu, and Aaron Barker The semiconductor industry has invested heavily in embedded monitors to gain visibility into advanced silicon. Those monitors are essential, but the next step is not simply to collect a larger volume of…...

3+ day, 19+ hour ago   (278+ words) Semiconductor manufacturing generates enormous volumes of data, yet only a fraction of it is analyzed. To quote a recent article from an industry analyst: “Beneath this growth lies a structural shift. Manufacturing complexity is rising faster than the industry’s ability…...

3+ day, 19+ hour ago   (590+ words) Through better manufacturing screening, DFT for systems and fleet monitors, this major scourge on data center hardware is gradually being tamed. SDEs are becoming an increasing problem partly because SDE faults are much more likely to happen at advanced process…...

3+ day, 19+ hour ago   (222+ words) How data feed-forward infrastructure collects, transforms, transports, and applies test data across the full supply chain. The post AI-Driven Data Feed Forward: Scaling Advanced Test Methodologies For Chiplet-Based Packages appeared first on Semiconductor Engineering. The transition from monolithic dies to…...