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News
Chip Security Moves From Checkbox Compliance To Continuous Defense
2+ hour, 36+ min ago (487+ words) Fig. 1: L-R: Synaptics’ Arora; Synopsys’ Hinkel; Arteris’ Siwinski; Cadence’s Vunnam; Keysight’s Petr; Rambus’ Best; and Siemens’ Giles. SE: Are you finding that customers have an organized plan to implement security tracking? Hinkel: That’s just enough to make the claim to…...
Blog Review: Aug. 26
2+ hour, 36+ min ago (269+ words) Synopsys’ Ravi Todi, Urmimala Roy, and Xi-Wei Lin examine the current state of gate-all-around transistors, what’s on the horizon with complementary FETs, and how backside power delivery and design technology co-optimization help enable the full benefits of the new architectures....
Redefining Roles For Edge And Cloud AI
1+ day, 2+ hour ago (152+ words) The race is on for localized intelligence. The post Redefining Roles For Edge And Cloud AI appeared first on Semiconductor Engineering. The rapid build-out of AI on the edge marks a fundamental shift in where intelligence is located, how much…...
Research Bits: Aug. 25
1+ day, 2+ hour ago (615+ words) Semiconductor Engineering Research Bits: Aug. 25 Bacterial transistors; forgetful antiferroelectrics; high-entropy mixing. Researchers from the Massachusetts Institute of Technology (MIT) engineered bacteria that can function as transistors and form circuits for environmental monitoring. The team used the bacterium Pantoea agglomerans to…...
Multi-Die Assemblies Dominate At 2nm And Below
2+ day, 2+ hour ago (997+ words) Chips are getting bigger, more modular, and much more capable as new innovations mix with existing processes and long-researched projects go mainstream. Multi-die assemblies and heterogeneous integration are becoming standard in leading-edge servers and high-end edge devices, forcing broad changes…...
SoC Lead - Senior Principal Engineer
2+ day, 16+ hour ago (219+ words) Solutions Engineering is at the forefront of developing ground breaking SoC/SiP (System-on-Chip / System-in-Package) solutions across a wide range of market segments including Cloud Ai, Edge AI, and Physical AI. In this critical leadership role, you will coordinate and be…...
Chip Industry Week In Review
5+ day, 2+ hour ago (355+ words) New Micron lab; chip/AI price jump; multi-die monitoring; cryo links for quantum chips; interconnect RC bottleneck; 18A win; CPO roadmap; 2 new CEOs; humanoid readiness gap; Hot Interconnects. In-Depth Deals and Funding New Technologies Security Vehicles, Batteries Trending Video Research Quantum…...
Scope 3 emissions Archives
5+ day, 16+ hour ago (60+ words) Semiconductor Engineering tag: Scope 3 emissions Reducing Scope 3 Value Chain Emissions For Customers Through Sustainability And Innovation Self-Driving Cars Have An Aging Problem Chip Industry Week In Review Copper’s Grip On AI Scaling Is Starting To Slip When Semiconductor Materials Misbehave…...
CFETs Forge Better Connections
6+ day, 2+ hour ago (773+ words) Performance advantage may come down to material choices and precise interconnect decisions. Optimizing the materials and process flows for CFET gate-stack fabrication is a major feat. The next big challenges will be making all the necessary vertical connections between the…...
Managing Thermal Expansion And Electromigration Through Interposer Design
6+ day, 2+ hour ago (299+ words) New deep learning models may provide a pathway for modeling warpage. As scaling transistors laterally becomes more difficult, manufacturers are turning to vertical transistor designs such as CFETs and vertical packaging to increase device density. At the same time, the…...