News
Topology and Data Movement in Multi-Die Design
3+ day, 11+ hour ago (312+ words) Whilst chiplets garner much interest, many remain cautious about adopting multi-die solutions because the technology transition affects far more than just packaging; it changes the approach to design methodology, verification, manufacturing, and system architecture. However, recognizing the potential payoffs helps…...
Vivante GC7000 GPUs Deliver Desktop-Class Graphics to Mobile Devices
10+ mon, 4+ week ago (713+ words) Sunnyvale, CA " April 3 rd, 2014 " Vivante Corporation today announced multiple silicon partner integrations of its GC7000 Series GPU IP into So Cs targeting wearables, mobile, automotive, and 4 K TV. .. Vivante GC7000 GPUs Deliver Desktop-Class Graphics to Mobile Devices Built on the market success…...
The 5 Biggest Challenges in Modern So C Design (And How to Solve Them)
1+ week, 6+ day ago (633+ words) The result is a structural shift: the fabric is no longer background infrastructure but has become the performance governor. Here are the five defining challenges architects now face, and what is required to address them. Modern So Cs are no…...
Siemens launches Fuse EDA AI Agent for automation across semiconductor, 3 D IC and PCB system workflows
1+ mon, 3+ day ago (855+ words) Fuse EDA AI Agent autonomously orchestrates multi-agent workflows across Siemens' complete electronic design automation (EDA) portfolio, from design conception through manufacturing sign-off, .. . Siemens launches Fuse EDA AI Agent for automation across semiconductor, 3 D IC and PCB system workflows March 17, 2026 - - Fuse…...
Socionext Collaborates with Arm to Advance AI Data Center Infrastructure with Arm Total Design
6+ day, 11+ hour ago (183+ words) April 13, 2026 - System-level functionality is achieved by packaging multiple chiplets into a single So C, incorporating the required number of XPUs and IO chiplets. The IO chiplets enable the So C to be deployed in scale-up or scale-out configurations. The AI…...
Eliyan Appoints former head of Facebook/Meta AI infrastructure Dr. Jason Taylor to Board of Directors
11+ mon, 2+ hour ago (450+ words) SANTA CLARA, Calif. " November 28, 2023 " Eliyan Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today announced. .. Eliyan Appoints former head of Facebook/Meta AI infrastructure Dr. Jason Taylor to Board of Directors SANTA CLARA,…...
IBM Announces Strategic Collaboration with Arm to Shape the Future of Enterprise Computing
1+ week, 6+ day ago (600+ words) IBM (NYSE: IBM) today announced a strategic collaboration with Arm to develop new dual'architecture hardware that helps enterprises run future AI and data intensive workloads with greater flexibility, .. . IBM Announces Strategic Collaboration with Arm to Shape the Future of Enterprise…...
RISC-V So C supports voice-enabled Io T devices
6+ day, 10+ hour ago (92+ words) Espressif Systems is sampling its ESP32-S31 dual-core RISC-V So C with Wi-Fi 6, Bluetooth 5. 4, Thread, Zigbee, and Ethernet. Rich HMI and security features make it well-suited for Io T applications such. .. RISC-V So C supports voice-enabled Io T devices April 13, 2026 - Espressif Systems…...
Si Five Raises $400 Million to Accelerate High-Performance RISC-V Data Center Solutions; Company Valuation Now Stands at $3. 65 Billion
6+ day, 11+ hour ago (464+ words) Si Five, the gold standard for RISC-V processor IP, today announced it has raised $400 million in an oversubscribed Series G financing to accelerate its high-performance data center roadmap. This. .. Si Five Raises $400 Million to Accelerate High-Performance RISC-V Data Center Solutions;…...
PLDA Announces Integration of their PCIe 3. 0 Controller IP into Kazan Networks' NVMe Over Fabric Fuji ASIC, Providing a Dramatic Increase in Scalability and Flexibility for Storage Applications
10+ mon, 4+ week ago (143+ words) PLDA and Kazan to Highlight their Products at Flash Memory Summit 2018 in Santa Clara, CA from August 7 " 9, 2018 "PLDA is thrilled to contribute our best-in-class Xpress RICH3 IP to Kazan Networks" innovative NVMe-o F ASIC, and enable the industry"s best discrete…...