News
Rambus Unveils HBM4E Controller Enabling C-HBM4E
2+ hour, 58+ min ago (962+ words) Rambus has introduced one of the industry's first memory controller IPs that support HBM4E memory, designed to handle data transfer rates of up to 16 GT/s to deliver bandwidth of 4 TB/s per HBM4E memory stack. The controller IP supports various proprietary…...
AC/DC Power Converters Are Coming Out of Their Host’s Box
2+ week, 17+ hour ago (581+ words) What's driving this transition? Using an external, independent unit for AC/DC power makes a lot of sense for various reasons. There's no single driving factor, as vendors often have one or more priorities and preferences for their target market:…...
Industry Prepares for ‘Verified Sustainability’ in 2026
2+ week, 21+ hour ago (450+ words) For years, sustainability in consumer electronics has become a growing concern. But, as 2026 begins, society must start taking real action to tackle this head-on. In fact, circularity is no longer an aspiration; it's becoming a requirement, backed by regulation, investor…...
AI Ushers In the Age of No-Compromise Gaming
2+ week, 1+ day ago (214+ words) Currently, FSR Redstone has three main ML capabilities: upscaling, frame generation, and ray regeneration. Meanwhile, DLSS 4.5 features its own upscaling abilities, along with the previously mentioned 6X frame generation and dynamic frame generation. Even though these capabilities are listed, the question…...
Embedded World 2026 Confronts Mounting Integration Complexity
2+ week, 2+ day ago (262+ words) As embedded world 2026 pulled the curtains, it left much to contemplate, even though it delivered fewer surprises than in previous editions. As expected, there was a pristine focus on embedded connected intelligence. CCStudio Edge AI enables AI models to run…...
IBM, Lam Research Focus High-NA EUV on Sub-1-nm Nodes
2+ week, 5+ day ago (670+ words) IBM and Lam Research aim to make chips beyond the 1-nm node. The companies, however, declined to disclose potential chipmaking partners or a timeline for commercial production. IBM and Lam Research have a five-year agreement focused on developing new materials,…...
Arm Positions Neoverse for AI and Telco Networks at MWC
3+ week, 1+ day ago (985+ words) BARCELONA, Spain " At the 2026 Mobile World Congress (MWC), Arm showed its technology as the telecommunications sector faces a dual mandate: managing the capital expenditures of existing 5G networks while preparing for the AI workloads that will define the upcoming 6G standard. Arm…...
Taiwan Extends Reach from Chips to Embedded Systems
3+ week, 14+ hour ago (742+ words) For this reason, the use of AI in the dynamic optimization of computing resources, energy management, and workloads is one of the main drivers of development in next-generation embedded systems, particularly for distributed peripheral computing architectures. In addition, chip design…...
TI Adds NPU to AM13E230x MCU Family
3+ week, 2+ day ago (759+ words) At embedded world 2026, TI has launched a new family of real-time microcontrollers (MCUs) with a proprietary on-chip micro-NPU: the AM13E230x. This is the third MCU in the TI lineup to get the company's NPU, branded "TinyEngine," Amichai Ron, senior VP for…...
The Industry is Striving for Custom Memory (Part 1)
3+ week, 1+ day ago (763+ words) However, because emerging AI workloads tend to be very different, they require different types of memory, which concerns both standard and custom types of memory. To that end, in addition to a bunch of high-performance types of memory already available,…...