News
ASML announces breakthrough in EUV light source to boost chip output
1+ hour, 29+ min ago (318+ words) ASML has unveiled a significant advance in the power of the light source used in its extreme ultraviolet (EUV) lithography systems, a development the company says could enable chipmakers to produce up to 50% more semiconductors by the end of the…...
Keysight launches 3D interconnect design tool for advanced chiplet and 3DIC packages
1+ day, 1+ hour ago (401+ words) Keysight Technologies has introduced a new software tool aimed at tackling the growing complexity of 3D interconnect design in high'density chiplet and 3DIC packages. Keysight launches 3D interconnect design tool for advanced chiplet and 3DIC packages The 3D Interconnect Designer, now part of the company's…...
Accelerating semiconductor and electronic systems design using AI-powered digital twins
5+ day, 8+ hour ago (620+ words) In this Q&A with Craig Johnson, Vice President, EDA Strategy, Siemens EDA, covers the exponential growth of the semiconductor industry and software-defined electronics that will require an AI-powered comprehensive digital twin for silicon-enabled systems of systems development. With the…...
Renesas presents new SoC technologies for next‑generation automotive ECUs
5+ day, 18+ hour ago (140+ words) Renesas Electronics has developed three new system'on'chip (SoC) technologies designed to power the next generation of automotive multi'domain electronic control units (ECUs). Intended to address rising performance, safety and efficiency demands in software'defined vehicles, the company presented the advances at…...
ByteSnap Design and Digi International launch managed security service for embedded Linux devices
6+ day, 1+ hour ago (363+ words) ByteSnap Design has partnered with Digi International to introduce a managed security service aimed at helping manufacturers keep embedded Linux devices secure throughout their operational lifetimes. The new Premium Software Security Service is designed to streamline cybersecurity management for connected…...
Renesas unveils 3nm TCAM technology designed for high density and low power
6+ day, 8+ hour ago (266+ words) Renesas Electronics has announced a new ternary content'addressable memory (TCAM) technology built on a 3nm FinFET process. Each hard macro integrates an all'mismatch detection circuit and uses a two'stage pipelined search system. Depending on the first'stage result, the second stage can…...
Toshiba introduces 6500V/2000A Press-Pack IEGT for high-voltage transmission and industrial drives
1+ week, 1+ hour ago (215+ words) The new device responds to rising demand for compact, energy'efficient solutions in large'scale electrical systems, including HVDC converter stations and STATCOM units. At its core are newly developed trench'type IEGT chips with an optimised cell structure, which deliver improved turn'off…...
Silanna releases compact laser firing chips for next‑generation LiDAR systems
1+ week, 14+ hour ago (231+ words) Silanna Semiconductor has begun full'scale production of what it describes as the industry's smallest and most efficient laser firing system ICs, targeting LiDAR and rangefinder applications that require reduced power use and compact designs. The new FirePower devices - the SL2001 and…...
Applied Materials reportedly fined $252m for unlicensed shipments to China’s SMIC
1+ week, 1+ day ago (312+ words) According to Reuters, the U.S. Department of Commerce has been investigating claims that Applied Materials manufactured ion implanters at a facility in Massachusetts before routing them through a South Korean subsidiary and on to SMIC without the required export licences. The…...
SemiQ signs distribution deal with NAC Semi broadening access to SiC technologies
1+ week, 4+ day ago (254+ words) SemiQ has entered into a distribution partnership with NAC Semi in a move aimed at expanding the availability of its silicon carbide (SiC) power solutions across North American markets. The agreement will see NAC Semi supply SemiQ's portfolio of SiC…...