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Semiconductor Engineering
semiengineering. com > silent-data-corruption-a-major-reliability-challenge-in-large-scale-llm-training-tu-berlin

Silent Data Corruption: A Major Reliability Challenge in Large-Scale LLM Training (TU Berlin)

3+ hour ago  (328+ words) A new technical paper, "Exploring Silent Data Corruption as a Reliability Challenge in LLM Training," was published by researchers at Technische Universitat Berlin. Abstract "As Large Language Models (LLMs) scale in size and complexity, the consequences of failures during training…...

Semiconductor Engineering
semiengineering. com > an-engineering-roadmap-toward-completely-neural-computers-meta-ai-kaust

An Engineering Roadmap Toward Completely Neural Computers (Meta AI, KAUST)

22+ hour, 6+ min ago  (501+ words) A new technical paper, "Neural Computers," was published by researchers at Meta AI and KAUST. Abstract "We propose a new frontier: Neural Computers (NCs) " an emerging machine form that unifies computation, memory, and I/O in a learned runtime state....

Semiconductor Engineering
semiengineering. com > study-of-euv-nanostructures-using-afm-with-high-aspect-ratio-tip-purdue-intel-bruker

Study of EUV Nanostructures Using AFM With High-Aspect Ratio Tip (Purdue, Intel, Bruker)

1+ day, 2+ hour ago  (242+ words) Semiconductor Engineering Study of EUV Nanostructures Using AFM With High-Aspect Ratio Tip (Purdue, Intel, Bruker) A new technical paper, "Characterizing tip-sample interaction dynamics on extreme ultraviolet nanostructures using atomic force microscopy with a high-aspect ratio tip," was released by researchers…...

Semiconductor Engineering
semiengineering. com > pdn-challenges-in-dram-based-compute-in-memory-systems-ut-austin

PDN Challenges In DRAM-Based Compute-In-Memory Systems (UT Austin)

1+ day, 3+ hour ago  (658+ words) A new technical paper, "A comparative study on power delivery aspects of compute-in/near-memory approaches using DRAM," was published by researchers at UT Austin. Abstract "Compute-in-memory (PIM) mitigates the memory wall by performing computation within memory, reducing data movement and…...

Semiconductor Engineering
semiengineering. com > photonic-packaging-resistant-to-extreme-environments-nist-johns-hopkins-u-of-maryland

Photonic Packaging Resistant to Extreme Environments (NIST, Johns Hopkins, U. Of Maryland)

1+ day, 3+ hour ago  (90+ words) A new technical paper, "Photonic chip packaging for extreme environments" was published by NIST, Johns Hopkins and University of Maryland. Abstract "Integrated photonic sensors have advanced significantly in the past decade for an ever-increasing range of applications, driven by the…...

Semiconductor Engineering
semiengineering. com > ssd-emulator-for-massively-parallel-gpu-centric-storage-kaist

SSD Emulator For Massively Parallel, GPU-Centric Storage (KAIST)

1+ day, 3+ hour ago  (562+ words) A new technical paper, "Swarm IO: Towards 100 Million IOPS SSD Emulation for Next-generation GPU-centric Storage Systems," was published by KAIST. Abstract "GPU-initiated I/O has emerged as a key mechanism for achieving high-throughput storage access by leveraging massive GPU thread-level…...

Semiconductor Engineering
semiengineering. com > impact-of-surface-states-and-band-modulations-in-ruthenium-interconnects-incheon-hanyang-ut-dallas

Impact of Surface States And Band Modulations in Ruthenium Interconnects (Incheon, Hanyang, UT Dallas)

1+ day, 3+ hour ago  (549+ words) A new technical paper, "Role of surface states and band modulations in ultrathin ruthenium interconnects," was published by researchers at Incheon National University, Hanyang University and UT Dallas. Abstract "Mitigating the RC delay from transistor miniaturization is essential for next-generation…...

Semiconductor Engineering
semiengineering. com > chip-industry-week-in-review-133

Chip Industry Week In Review

2+ day, 15+ hour ago  (386+ words) Intel teams up everywhere; GPU rowhammer attack; fast verification; Taiwan IC industry wants stockpiles; China poaches Taiwan talent; thinnest Ga N chiplet; AFM-IR; Europe revenue drop; new edge design; BMW hydrogen power; Japanese automotive trouble. Fig. 1: A cross-sectional electron microscope…...

Semiconductor Engineering
semiengineering. com > power-integrity-without-blind-spots-a-system-level-approach-to-3d-ics

Power Integrity Without Blind Spots: A System Level Approach To 3 D-ICs

3+ day, 15+ hour ago  (673+ words) Power delivery now spans stacked dies, interposers, bridges, and packages connected by thousands of micro-bumps and TSVs. In modern multi-die architectures, power delivery is no longer confined to a single chip. Instead, it spans stacked dies, interposers, bridges, and packages…...

Semiconductor Engineering
semiengineering. com > early-hbm4-validation-points-the-way-for-next-generation-ai-and-hpc-systems

Early HBM4 Validation Points The Way For Next Generation AI And HPC Systems

3+ day, 15+ hour ago  (554+ words) First silicon alone is no longer sufficient to establish readiness for next-generation designs. The post Early HBM4 Validation Points The Way For Next Generation AI And HPC Systems appeared first on Semiconductor Engineering. As AI and high'performance computing systems continue to…...