2+ hour, 19+ min ago   (212+ words) Researchers from MIT, Google, and University of Washington published a technical paper titled “Granite: A Modular Methodology for Foundational Verification of Hardware-Software Leakage Contracts.” Abstract Excerpt: “Granite is a methodology for modular verification of both functional correctness and nonleakage of…...

2+ day, 14+ hour ago   (438+ words) DAC’s big buzz; CHIPS Act $; China’s immersion DUV; UMC expands; SIA’s state of the industry; DRAM shortages; earnings; PCB design credential program; IBM’s quantum advantage; AI security alliance; foreign robotics ban. The energy and buzz at this year’s Design Automation…...

3+ day, 22+ hour ago   (117+ words) Researchers from Stanford University and Hanyang University published a technical paper titled “Bridging the p-type gap in oxide electronics with 2D semiconductors.” “The review assesses manufacturing-aligned pathways to high-performance 2D p-channel transistors, covering transfer-free low-temperature growth, clean van der Waals contacts, gentle…...

3+ day, 22+ hour ago   (150+ words) Researchers from University of Houston, Toyota, and Imperial College London published a technical paper titled “Deployable 3D Architectures from Wafer-Fabricated Precursors.” The paper shows that “standard wafer fabrication can produce free-standing, mechanically stable, doubly-curved 3D structures with prescribed Gaussian curvature — a capability…...

5+ day, 14+ hour ago   (206+ words) HW methods to throttle AI; M3D DRAM; interconnect signal-integrity analysis; 3D mask effects in high/hyper-NA EUV litho; compute-in-interconnect and memory; NbAs nanowire interconnects; and 3D conformal thin-film patterning. The post Chip Industry Technical Paper Roundup: July 28 appeared first on Semiconductor Engineering. New…...

5+ day, 14+ hour ago   (199+ words) The device structure evolves through successive iterations of the computational optimization process, resulting in irregular patterns of holes and ridges. “Inverse design becomes practical when fabrication realities are built into the optimization,” said Kiyoul Yang, assistant professor of electrical engineering…...

6+ day, 14+ hour ago   (468+ words) Jobs, markets, and economics are undergoing dramatic changes, but it’s still too early to know how this will all shake out. SE: How will AI affect engineering jobs? SE: Is the learning curve changing with AI? SE: How do we…...

6+ day, 14+ hour ago   (127+ words) How to achieve a 10X productivity improvement using AI agents. The post AI Agent Orchestration For ASIC Autonomy appeared first on Semiconductor Engineering. The use of AI agents in chip design has been limited to small portions of the design flow…...

6+ day, 14+ hour ago   (328+ words) A standardized way for future automation. As designs become more complex and supply chains more distributed, these challenges only continue to grow. The industry has long benefited from standards that define what is required to achieve functional safety. Standards such…...

1+ week, 3+ day ago   (242+ words) Change is coming, but how quickly depends on the availability of data and when chipmakers are confident enough to let AI take over. Agentic solutions are more than a wrapper on top of existing tools. They will transform tools into…...